Kompakt COM-modul baseret på Freescale i.MX6
TechNexion lancerer COM modul bygget op omkring en Freescale i.MX6 processor sammen med dedikeret carrier board (in english).
TechNexion has announced a tiny 36 x 40 mm PICO-IMX6-SD computer-on-module (COM) based on the Freescale i.MX6, along with a 'PICO-Dwarf' carrier board that converts the COM into a sandwich-style single board computer, like the gateway.The PICO-IMX6-SD reference design based on the Freescale i.MX6 multimedia processor is a purpose-built, small footprint hardware platform equipped with a wide array of high-speed connectivity engineered to support internet-of-things endpoints, wearable applications, appliances, drones or industrial mobile terminals.
The affordable reference design is compatible with Intel Edison baseboards and adds a number of additional high-speed signals such as PCIe, RGMII LAN, USB as well as 24 bit TTL Display, LVDS, HDMI and MIPI CSI Camera and MIPI DSI Display options.
The PICO-IMX6-SD combines outstanding detailed documentation and design files to integrate the module into your designs with support for Linux 3.x kernel source code and has recipes for Yocto, Ubuntu and Android 4.3/4.4/5.0 available.
It supports GbE RGMII, WLAN, Bluetooth connectivity and I/Os include GPIO x9, PWM x4, I²C x2, I²S x1, SPI, UART and SDIO (4-bit). Supportet DDR3 memory is 512MB or 1GB.
Applications includes appliances, drones, industrial mobile terminals, wearable applications etc..
Texim Europe B.V.
www.texim-europe.dk
nordic@texim-europe.com
Telefon: +45 8820 2632
