Powermodul med høj effektivitet og lav termisk modstand
Med sigte på industrielle applikationer lancerer Texas Instruments nyt 36V, 4A powermodul i en QFN-pakning (in english).
Texas Instruments (TI) has introduced the industry’s smallest 36-V, 4-A power module in a quad flat no-lead (QFN) package. The TPSM53604 DC/DC buck module’s 5-mm-by-5.5-mm footprint enables engineers to shrink the size of their power supply by 30% while reducing power loss by 50% when compared to similar competing modules.The new power module comes with a single thermal pad to optimize heat transfer, enabling engineers to simplify board mounting and layout. The TPSM53604 can operate in ambient temperatures as high as 105°C to support rugged applications in factory automation and control, grid infrastructure, test and measurement, industrial transport, and aerospace and defense.
By pairing the TPSM53604 with a compact step-down module such as the TPSM82813 and TPSM82810, engineers can create a complete power solution from a 24-V input down to the point of load, while minimizing design time and effort.
Key benefits and features of the TPSM53604:
- Shrink and simplify the power solution: Its total area of 85 mm 2 for a single-sided layout is the smallest solution for common 24-V, 4-A industrial applications. The standard QFN footprint helps simplify design and thereby reduce time to market.
- Efficiently dissipate heat at high ambient temperatures: 42% of the TPSM53604’s QFN package footprint touches the board, enabling more efficient heat transfer compared to competing ball-grid-array (BGA) packages. In addition, the module’s buck converter integrates MOSFETs with low drain-source on resistance (RDS(on)) to enable conversion efficiency of 90% at 24 V to 5 V.
- Easily meet EMI standards: The TPSM53604’s integrated high-frequency bypass capacitors and lack of bond wires help engineers meet the electromagnetic interference (EMI) standard defined by CISPR (Comité International Spécial des Perturbations Radioélectriques) 11 Class B limits.
