Power Mosfets 'dobbeltkøles' i ny pakning
Fairchild Semiconductor’s nye Dual Cool pakning forbedrer powerdensiteten og ydelsen i DC-DC power applikationer (in english).
Designers of DC-DC conversion applications are challenged with improving power density while saving board space and reducing thermal resistance. Fairchild Semiconductor’s new mid-voltage PowerTrench MOSFETs with Dual Cool packaging technology are well suited to help with these design challenges.
Fairchild has expanded and improved its Dual Cool packaging portfolio, an industry-standard pin-out package with top-side cooling, to include a 40-100V mid-voltage series. Silicon technology advancements, paired with the Dual Cool technology, provide excellent switching performance as well as low junction-to-ambient thermal resistance that is four times less than the standard over-molded 5mm x 6mm MLP.
Devices included in the mid-voltage series include the 40V FDMS8320LDC, 60V FDMS86500DC, 80V FDMS86300DC and the 100V FDMS86101DC. These devices are synchronous rectifying MOSFETs that are suitable for use in DC-DC converters, telecom secondary-side rectification and high-end server/workstation applications. www.fairchildsemi.com/dualcool.
