NEXFET Power Block i SON-pakning
Texas Instruments lancerer NexFET Power Block enheder i en pakning på 3 mm x 3 mm (in english).
Texas Instruments (TI) has introduced a new NexFET Power Block device in a space-saving 3-mm x 3-mm SON package. The new CSD86330Q3D Power Block package achieves greater than 90 percent efficiency at 15 A in half the area of competitive solutions that require two discrete power MOSFETs in 3-mm x 3-mm QFN packages.The Power Block has a significant advantage in power loss and output current capabilities over competitive solutions, and supports applications like servers, desktop and notebook PCs, networking equipment, cellular infrastructure, high-end consumer applications and merchant power supplies.
www.ti.com/powerblock-preu.
