Cypress vil sæt fart i adoptionen af USB 3.0
Med sigte på at accelerere USB 3.0 designaktiviteterne introducerer Cypress 'SuperSpeed Explorer Kit' til bare 49 dollars (in english).
Cypress Semiconductor has introduced a low-cost, easy-to-use development platform that enables designers to add high-performance USB 3.0 throughput to virtually any system. The new SuperSpeed Explorer Kit, now available for $49 online, is based on Cypress’s programmable EZ-USB FX3 USB 3.0 peripheral controller, which offers the flexibility to address a broad range of applications. Cypress will demonstrate the kit at the Intel Developer Forum (IDF) in San Francisco from September 9-11EZ-USB FX3 is the industry’s only programmable USB 3.0 peripheral controller. It is equipped with a highly configurable General Programmable Interface (GPIF II), which can be programmed in 8-, 16-, and 32-bit configurations. GPIF II allows FX3 to communicate directly with application processors, FPGAs, storage media, and image sensors and provides a data transfer rate of up to 400 Megabytes per second, while using lower power than alternative solutions.
The SuperSpeed Explorer Kit easily interfaces with external devices via three accessory boards that connect to Aptina image sensors, Altera FPGAs and Xilinx FPGAs, respectively. The kit also includes an integrated debugger with a standard USB interface to further simplify designs and speed time to market.
- With the unique programmability of Cypress’s FX3 solution, our new $49 SuperSpeed Explorer kit makes it easier and more cost-efficient than ever before for designers to add USB 3.0 to their next-generation products, says Mark Fu, senior marketing director of the USB 3.0 Business Unit at Cypress.
EZ-USB FX3 provides SuperSpeed USB 3.0 connectivity to virtually any system. The on-chip ARM9 CPU core with 512 KB RAM delivers 200 MIPS of computational power and is available for applications that require local data processing. Additionally, FX3 provides SPI, UART, I2C and I2S interfaces to connect to serial peripherals. In short, FX3 provides highly flexible and integrated features that enable developers to add USB 3.0 connectivity to any system.
EZ-USB FX3 is in volume production now and is available in two packages: a 121-ball BGA (10 mm x 10 mm) and a space saving 131-ball Wafer-Level Chip Scale Package (WLCSP) with dimensions of 4.7 mm x 5.1 mm. More information on Cypress’s USB 3.0 portfolio is available at www.cypress.com/usb
