Chip-scale LEDs til spotlights og high-bay applikationer
Samsung introducerer nye kraftigt forbedrede chip-scale LEDs til brug i spotlights og i high-bay applikationer (in english).
Samsung Electronics has announced two new additions to its chip-scale package (CSP) line-up: LM101B, a 1W-class mid-power LED, and LH231B, a 5W-class high-power LED. Built with enhanced CSP technology, the new LED packages deliver industry-leading efficacy and reliability for spotlights and high-bay lighting applications.The LM101B and the LH231B packages are based on Samsung’s state-of-the-art, fillet-enhanced CSP (FEC) technology, which forms TiO2 walls around the chip surface to reflect its light output toward the top, acting as a plastic mold in conventional EMC-based LEDs.
With their FEC design, the packages provide a higher light efficacy level compared to Samsung’s previous generation of CSP LEDs.
The more focused beam also helps to eliminate cross-talk between neighboring packages and enables the new packages to be placed in close proximity to one another, offering greater flexibility to luminaire designers.
- Our FEC line-up represents an outstanding set of highly advanced LED component solutions that accommodates a variety of luminaire designs from below 1,000lm to well over 10,000lm, says Jacob Tarn, executive vice president of LED Business Team at Samsung Electronics.
- Samsung will continue to pave the way for widespread adoption of CSP technology in the mainstream lighting market, bringing greater performance and cost benefits to a growing number of lighting manufacturers.
