Ny type stencil-teknologi

FCT Assembly introducerer den såkaldte NanoSlic Gold stencil-teknologi til print af loddepasta (in english).

NanoSlic Gold is developed to address the increasing demands confronting the electronic assembly industry. The NanoSlic Gold coating is based on a proprietary application process that coats both the underside of the stencil and aperture walls. This robust coating is both highly hydrophobic and oleophobic, which repels solder paste. NanoSlic Gold is thermally cured and is a permanent coating.

The NanoSlic technology significantly improves solder paste transfer efficiencies for small apertures resulting in higher yields and less rework. In addition, NanoSlic minimizes bridging and reduces underside cleaning. This technology can be easily evaluated and is compatible with current assembly equipment and processes.

- We have capitalized on our extensive knowledge and expertise in solder paste, polymer chemistry and stencil technology to develop NanoSlic, explains Mike Scimeca, President of FCT Assembly. 
http://www.fctassembly.com