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Engineered Material Systems, a leading global supplier of electronic materials for circuit assembly applications, debuts its CA-102 Conductive Adhesive designed for bonding components to circuit boards.
CA-102 has a moderate glass transition temperature (Tg) and modulus. The adhesive has an optimized rheology for screen printing and can be needle dispensed by time-pressure, auger or positive displacement. CA-102 is modified to provide conductivity stability during damp heat testing on tin, silver and copper surfaces. CA-102 is ideal for applications requiring lower stress, lower temperature processing or elimination of Pb in solder.
CA-102 is the latest addition to Engineered Material Systems’ extensive line of electronic materials for semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive and photonic applications.
