
ASM præsenterer fuldt integrerede elektronik-produktionssystemer
På SMT Hybrid Packaging udstillingen i begyndelsen af juni måned i Nürnberg vil den store leverandør af udstyr og sofware til opbygning af produktionssystemer, ASM, bl.a. fokusere på løsninger, der kan eliminere isolerede produktionsceller (in english).
Based on a fully coordinated portfolio of solutions in which all components complement each other and form an unbeatable whole, ASM experts will exhibit hardware, software, service and support solutions for the smart factory at the SMT Hybrid Packaging show (June 5-7, Nuremberg, Hall 4, Booth 309).The focus of this year's presentation will lie on eliminating isolated production cells by optimizing and integrating typical workflows within and beyond the SMT production line. At various workflow stations, ASM will demonstrate that new solutions like the ASM Production Planner, ASM Printer Programming, and ASM Command Center make it possible to create a fully connected production system ranging from planning to virtual and real production to monitoring and controlling.
In Nuremberg the faster version of the SIPLACE TX will also have its international premiere. For demanding mid-speed applications in the European market, ASM will present the E by SIPLACE and E by DEK. ASM process support products and new service tools like the Nozzle Cleaning Station and ASM Remote Smart Factory round out the equipment supplier's portfolio and help to make smart factory processes much more efficient.
ASM employees will also provide the latest information about new standards like The Hermes Standard and CFX, as well as about IIoT platforms and cloud solutions.
- We will demonstrate the full strength of our portfolio and our teams of experts at this year’s SMT show in Nuremberg. No other supplier has such a broad presence with solutions that complement each other and generate smart production concepts by working together, says Gabriela Reckewerth, Senior Director Global Marketing at ASM.
- The SMT Smart Network continues to grow, and new smart manufacturing solution help to make measurable improvements in the smart factory. To accomplish all this, the ASM team of experts works closely with partners and customers worldwide. One critical factor on this road is our Remote Smart Factory utility that combines a service tool, a communication platform and a control system in one, which is just one of the reasons why we put this year’s SMT presentation under the motto ‘The World Connected’.
At the SMT Hybrid Packaging show ASM will focus on typical SMT production workflows and how to improve them. Also on the agenda: new solutions like the ASM Production Planner, the ASM Command Center, the latest version of the SIPLACE TX, and the new Auto-Splice Tool and the Nozzle Cleaning Station.
SIPLACE TX: More performance, more flexibility
The new version of the SIPLACE TX will have its world premiere in Nuremberg. With its improved SIPLACE SpeedStar head, which places components ranging from 0201 metric to 8 x 8 x 2 mm, the SIPLACE TX becomes even faster with speeds of up to 95,000 cph. New options like the Long Board Option and Smart Pin Support make the placement platform even more flexible.
In combination with the SIPLACE SX, for example, it becomes the perfect solution for the kind of automotive applications that are typical on the European market. ASM's also made the SIPLACE TX more power-efficient than its predecessor. The new SIPLACE Smart Feeders with their improved pickup window play a major role in the impressive performance rating of the new SIPLACE TX and improve the first-component pickup reliability significantly.
Workflow improvements for smart SMT production
At various workflow stations, the ASM team will present solution chains for optimizing eight typical processes in electronics manufacturing: Planning, Virtual Production, Process Optimization, Production, Preparation, Material Management, Factory Monitoring, and Factory Integration. All these core processes can be networked, supported and largely automated with ASM solutions. Visitors can easily see how DEK, SIPLACE and ASM hardware and software solutions complement each other in the respective processes.
As an example of a smart line process, planning is of essential importance not only in high-mix environments. After production jobs have been imported from the MES or ERP system, modern software can quickly translate them into optimized setup sequences. Solutions like the ASM Production Planner and the innovative SiCluster Professional planning tool (or SiCluster Multiline for multiple lines) help manufacturers take their equipment's capabilities into account to generate smart production schedules.
Also new is ASM Offline Printer Programming for integrating DEK printing solutions into SIPLACE Pro. Printing programs can thus be generated offline and stored in the central SIPLACE Pro database, and programs for stencil printing individual products can be created centrally for all printers. When a program is downloaded, the system makes sure that the printer has all the necessary functions for executing it. This offline programming relieves the production line and eliminates error sources while raising throughput and productivity.
The Hermes Standard, ADAMOS and CFX provide data transparency and open communication on the factory floor
An absolute must for implementing smart production concepts is the availability of open standards and IIoT platforms. ASM is a member of The Hermes Standard Initiative for the development of an open, modern and powerful alternative to the obsolete SMEMA standard.
Based on TCP/IP and XML, the protocol of The Hermes Standard makes possible to transport board-related data across all stations of the line with total transparency and without the need for additional equipment such as barcode readers.
A logical counterpart to The Hermes Standard is the IPC’s new and open CFX standard, which enables the vertical exchange of data between the production equipment and higher-level systems. Manufacturers can thus collect and analyze machine information based on their specific needs. With ADAMOS, ASM and other industry leaders are establishing a special IIoT and cloud infrastructure especially for electronics manufacturers that supports central production process efficiently, globally, and on smart user devices.
E by DEK and E by SIPLACE: New features and options
ASM developed the E by DEK and E by SIPLACE printing and placement platforms especially for the mid-speed market as well as high-mix and prototype manufacturing applications. The machines set new standards in quality, performance and modularity in these market segments.
Based on feedback from users, the E-solutions will be further enhanced in 2018 with functions and options that have already demonstrated their usefulness on ASM’s high-speed platforms. For the E by DEK, these include the DEK Interchangeable Stencil Cleaner and DEK Adjustable-Width Stencil Mount.
For the E by SIPLACE, the Odd-Shape Component Package for the smart placement of large and unwieldy components and connectors is already available. The Ease of Use Package simplifies regular tasks like the teaching of trays, the handling of contaminated or defective nozzles, and the recognition of inverted diodes.
Smart service tools complete the ASM portfolio
Another focus area at the booth will be the smart service tools from ASM, such as a newly developed augmented reality maintenance app that guides users step-by-step through various assist scenarios. ASM Remote Smart Factory provides a secure global link between equipment supplier and electronics manufacturer that puts ASM support specialists and process experts within easy reach.
Electronics manufacturers can also use the networking platform as an in-house tool (Remote Operation) for seamless factory-to-factory communication. The ASM Nozzle Cleaning Station is faster, more thorough and more space-saving than third-party equipment. It cleans up to three nozzle magazines in only five minutes, and the cleaning takes place directly in the nozzle magazine eliminating the need to handle the nozzle. Also at the booth: the Auto-Splice Tool, which splices 8-millimeter paper and blister tapes automatically in only 15 seconds.