Intel løfter sløret for 14nm procesteknologi og ny mikroarkitektur

Intel offentliggør tekniske detaljer for ny mikroarkitektur, der vil blive benyttet i forbindelse med 14 nanometer Tri-gate (FinFET) procesteknologi. Første produkt i den teknologi bliver den kommende Intel Core M processor (in english),

The combination of the new microarchitecture and manufacturing process will usher in a wave of innovation in new form factors, experiences and systems that are thinner and run silent and cool, Intel explains.

Intel architects and chip designers have achieved greater than two times reduction in the thermal design point when compared to a previous generation of processor while providing similar performance and improved battery life.

- Intel’s integrated model – the combination of our design expertise with the best manufacturing process – makes it possible to deliver better performance and lower power to our customers and to consumers, says Rani Borkar, Intel vice president and general manager of product development.

- This new microarchitecture is more than a remarkable technical achievement. It is a demonstration of the importance of our outside-in design philosophy that matches our design to customer requirements. 

- Intel’s 14 nanometer technology uses second-generation Tri-gate transistors to deliver industry-leading performance, power, density and cost per transistor. Intel’s investments and commitment to Moore’s law is at the heart of what our teams have been able to accomplish with this new process, adds Mark Bohr, Intel senior fellow, Technology and Manufacturing Group, and director, Process Architecture and Integration.